JPS5987848A - 半導体集積回路基板電極膜の形成方法 - Google Patents

半導体集積回路基板電極膜の形成方法

Info

Publication number
JPS5987848A
JPS5987848A JP19682582A JP19682582A JPS5987848A JP S5987848 A JPS5987848 A JP S5987848A JP 19682582 A JP19682582 A JP 19682582A JP 19682582 A JP19682582 A JP 19682582A JP S5987848 A JPS5987848 A JP S5987848A
Authority
JP
Japan
Prior art keywords
metal film
layer
layer metal
film
etched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19682582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS646554B2 (en]
Inventor
Muneo Oshima
大島　宗夫
Masaru Sakaguchi
勝 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19682582A priority Critical patent/JPS5987848A/ja
Publication of JPS5987848A publication Critical patent/JPS5987848A/ja
Publication of JPS646554B2 publication Critical patent/JPS646554B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP19682582A 1982-11-11 1982-11-11 半導体集積回路基板電極膜の形成方法 Granted JPS5987848A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19682582A JPS5987848A (ja) 1982-11-11 1982-11-11 半導体集積回路基板電極膜の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19682582A JPS5987848A (ja) 1982-11-11 1982-11-11 半導体集積回路基板電極膜の形成方法

Publications (2)

Publication Number Publication Date
JPS5987848A true JPS5987848A (ja) 1984-05-21
JPS646554B2 JPS646554B2 (en]) 1989-02-03

Family

ID=16364286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19682582A Granted JPS5987848A (ja) 1982-11-11 1982-11-11 半導体集積回路基板電極膜の形成方法

Country Status (1)

Country Link
JP (1) JPS5987848A (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002172A (en) * 1997-03-12 1999-12-14 International Business Machines Corporation Substrate structure and method for improving attachment reliability of semiconductor chips and modules
JP2001284749A (ja) * 2000-03-29 2001-10-12 Matsushita Electric Ind Co Ltd プリント配線板
JP2007103840A (ja) * 2005-10-07 2007-04-19 Nec Electronics Corp 電子回路装置の製造方法
JP2007103816A (ja) * 2005-10-07 2007-04-19 Nec Electronics Corp 配線基板および電子回路装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0432967A (ja) * 1990-03-19 1992-02-04 Hitachi Ltd 臨床検査総合情報システム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002172A (en) * 1997-03-12 1999-12-14 International Business Machines Corporation Substrate structure and method for improving attachment reliability of semiconductor chips and modules
US6251766B1 (en) 1997-03-12 2001-06-26 International Business Machines Corporation Method for improving attachment reliability of semiconductor chips and modules
US6281581B1 (en) 1997-03-12 2001-08-28 International Business Machines Corporation Substrate structure for improving attachment reliability of semiconductor chips and modules
JP2001284749A (ja) * 2000-03-29 2001-10-12 Matsushita Electric Ind Co Ltd プリント配線板
JP2007103840A (ja) * 2005-10-07 2007-04-19 Nec Electronics Corp 電子回路装置の製造方法
JP2007103816A (ja) * 2005-10-07 2007-04-19 Nec Electronics Corp 配線基板および電子回路装置

Also Published As

Publication number Publication date
JPS646554B2 (en]) 1989-02-03

Similar Documents

Publication Publication Date Title
KR940001149B1 (ko) 반도체 장치의 칩 본딩 방법
US4710592A (en) Multilayer wiring substrate with engineering change pads
JP3502800B2 (ja) 半導体装置の製造方法
JP2006108690A (ja) 再配線基板を用いたウェーハレベルチップスケールパッケージの製造方法
JP3003624B2 (ja) 半導体装置
JPS5987848A (ja) 半導体集積回路基板電極膜の形成方法
JP2002076167A (ja) 半導体チップ、積層型半導体パッケージ、及びそれらの作製方法
EP1041617A1 (en) Semiconductor device and method of production thereof and semiconductor mounting structure and method
JP2001267461A (ja) 半導体装置の製造方法
JP2001210934A (ja) 実装基板、実装基板の製造方法および電子回路素子の実装方法
JP2751242B2 (ja) 半導体装置の製造方法
JP2661158B2 (ja) リードパターンの形成方法
KR950003861B1 (ko) 박형코일의 제조방법
JPH04278542A (ja) 半導体装置及びその製造方法
JPH02170434A (ja) バンプ電極を備える半導体集積回路装置
JPS592329A (ja) 半導体集積回路基板の製造方法
JPH02174240A (ja) 半導体装置の製造方法
JPH0417345A (ja) 両面導電層フィルムキャリアテープの製造方法
JPH0715909B2 (ja) 半導体装置の製造方法
JPS6110472A (ja) サ−マルヘツドの製造方法
JPH05121617A (ja) リードフレームの製造方法
JPH0287538A (ja) テープキャリアモジュール
JPS59115871A (ja) サ−マルヘツドの製造方法
JPS63187687A (ja) 印刷配線基板の製造方法
JPS62120050A (ja) 半導体装置の製造方法